Laser Line Triangulation Profilometry Principles on Continuous Paperboard Substrates
Inline blue laser triangulation measures paperboard surface topography at high speeds by overcoming fiber light penetration and isolating mechanical flutter.
Pinhole Prediction
Barrier Integrity
The analytical method of forecasting the occurrence of microscopic voids in thin protective coatings or laminates on paperboard prevents barrier failures in packaging. Using pinhole prediction allows converters to estimate the shelf-life performance of liquid packaging board before it is shipped to the filling line. These tiny openings can develop during the extrusion process due to moisture in the paper substrate or uneven coating application.
Detecting the likelihood of these defects prevents oxygen from spoiling the packaged product.
Statistical Modelling
Mathematical models use surface roughness and coating thickness data to estimate the risk of defect formation. This pinhole prediction relies on measuring the peak-to-valley profile of the paperboard alongside the wet film thickness of the polymer. When the height of a surface fibre exceeds the thickness of the applied coating, a void is highly likely to form.
This relationship is calculated across different run speeds to establish safe processing limits for the extrusion coater.
Quality Assurance
Quality control is improved by replacing destructive testing with proactive analysis. Instead of testing samples with dye penetrants after production, converters use the model to adjust coater settings in real time. This adjustment reduces substrate waste and ensures that high-barrier properties are maintained throughout the production run.