
Interfacial Shear Strain and Delamination Dynamics in Thermal Plastic Board Lamination
Interfacial shear strain from thermal mismatch drives delamination; controlling cooling gradients and dyne levels prevents bond failure at crease lines.

Interfacial shear strain from thermal mismatch drives delamination; controlling cooling gradients and dyne levels prevents bond failure at crease lines.

Substrate core thermal expansion limits dictate sheet dimensional stability, requiring precise thermal control to prevent misregister and bimetallic warp.
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