Void Measurement
Void measurement evaluates microscopic permeability profiles across paper and board substrates through localized fluid penetration metrics. Barrier coatings on flexible packaging materials require pinhole density testing to verify continuity against gas and moisture migration paths. Microscopic imperfections allow atmospheric oxygen and water vapor to degrade sensitive food contents within laminates.
Converting plants apply automated optical scanners or high voltage electrical discharge detectors to quantify these defects per square meter of running web. Production managers track defect counts to prevent seal failures during vertical form fill seal operations.
Substrate Integrity
Substrate integrity depends on uniform coating thickness applied during calendering and blade processing steps. Pinholes originate from air entrapped in latex emulsions or fibrous voids left by incomplete furnish refinement. Converting lines running polyethylene extrusion coatings monitor void frequencies constantly because pinhole density testing reveals pin point applicator die wear or improper melt temperature.
High pinhole counts compromise aroma retention in barrier pouches and invalidate food contact compliance certifications.
Barrier Thresholds
Barrier thresholds define maximum acceptable defect frequencies for specialized end use specifications. Converter specifications enforce strict upper limits where pinhole density testing exceeds five defects per square meter on metallized films. Exceeding this boundary causes premature oxidation in vacuum packed dried goods and shortens shelf life expectations.
High speed printing presses generate mechanical stress that enlarges micro fractures and accelerates vapor transmission rates.