White Lined Chipboard

Application Parameters

Printing facilities demand high surface smoothness to ensure consistent dot reproduction when using offset lithography or gravure processes. Converting machines maintain precise tension settings as the material travels through cutting and creasing stations to ensure alignment. The white lined chipboard exhibits specific grain directionality that dictates the ease of folding along score lines.

Variations in the moisture level of the environment trigger expansion or contraction of the fibres, which disrupts the register of high speed print jobs. Operators adjust the pressure on the cutting dies based on the density of the recycled core to avoid fracturing the surface ply. If the folding force exceeds the internal bond strength of the board, delamination occurs at the corners of the finished carton.

Such failures reduce the integrity of the secondary packaging.

Material Specification

Performance standards for this grade rely on the grammage and the smoothness of the coated face rather than total fibre purity. Mills certify the brightness of the outer surface to maintain consistent visual appeal across different batches. The base board density creates the stiffness necessary for stacking cartons on pallets without the side walls collapsing under load.

Heavy ink coverage demands a high surface strength to prevent picking during the stripping of excess board from the die cut sheet. Final quality assurance verifies the pick resistance of the coating to ensure compatibility with high speed gluing equipment. The density of the recycled fibres ensures the board holds complex structural shapes after folding.