
Rotary Die Scoring Stress Wave Signal Acquisition
Real-time acoustic stress wave monitoring on rotary die scoring lines detects paperboard matrix micro-cracking instantaneously, reducing convert scrap by up to 80 percent.

Real-time acoustic stress wave monitoring on rotary die scoring lines detects paperboard matrix micro-cracking instantaneously, reducing convert scrap by up to 80 percent.

Air-coupled ultrasonic guided waves quantify paperboard crease ply delamination and micro-cracking non-destructively, preventing box compression failure.

High frequency ultrasonic attenuation profiling non-destructively maps internal ply delamination and polymer barrier continuity during cartonboard creasing passes.

Piezoelectric stress wave monitoring detects cartonboard score cracking in real time by capturing high-frequency elastic strain transients at rotary die nips.

Online acoustic emission monitoring detects micro delamination along carton scores in real time to prevent line jams and outer liner cracking.
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