Internal Adhesion
Internal delamination resistance quantification of paperboard provides an indicator of how the material will perform during printing and converting. The scott bond tappi t 569 test measures the energy required to rapidly separate the fibers within the thickness of the sheet. This property is vital for preventing the board from splitting when it is subjected to the high tack of offset inks.
Kinetic Impact
The procedure uses a pendulum to strike a metal angle that is bonded to the surface of the paper with double sided tape. As the pendulum falls it transfers energy to the sample and causes it to rupture internally. The loss of energy in the pendulum is recorded and converted into a value expressed in joules per square meter.
Higher values indicate a stronger internal bond and a lower risk of delamination during the printing process. Board structure and the use of internal sizing agents are the primary factors that influence this result. Consistent testing ensures that the material can withstand the mechanical stresses of a high speed press.
Grade Suitability
Variations in the bond strength can occur across the width of the paper machine or between different production batches. Low bond values can lead to costly downtime if the surface of the board peels away during the ink transfer. The test establishes the minimum strength requirement for grades used in demanding applications.
It provides a reliable metric for assessing the structural integrity of multi-ply board.
