Coating Void
Microscopic openings or gaps in a thin polymer or aqueous coating expose the underlying paperboard directly to the atmosphere. The occurrence of pinhole formation is often driven by air entrapment, surface contamination, or improper drying of the liquid coating. This coating defect allows oils and water to penetrate the package and stain the board.
Process Cause
During the coating process, bubbles can form in the wet film if the drying oven temperature is set too high or if the coating has high foam stability. As the coating dries, these bubbles burst and leave behind small craters that do not close before the polymer sets. This problem is particularly severe with low-viscosity dispersions run at high speeds.
Barrier Failure
Applying multiple thin layers instead of a single thick layer is a common strategy to mitigate this issue, as the likelihood of two pinholes aligning is extremely low. Routine quality checks, such as dye stain or electrical conductivity testing, help operators detect the presence of these voids before the board is shipped to the converter. In food-contact packaging, preventing pinhole formation is essential to maintain the necessary shelf life and prevent grease spots from forming on the exterior of the box.