Dynamic high-speed shear delamination across mechanical board cores occurs when strain rates exceed interfacial starch adhesion, requiring dynamic shear specification over static Scott bond values.
Dynamic mechanical analysis identifies hemicellulose moisture thresholds that prevent score cracking during high speed converting of mechanical pulp middle plies.
Dynamic strain rate modeling predicts multi-ply boxboard Z-direction compression and interlayer shear collapse during high-speed converting and package drops.
Air-coupled ultrasonic guided waves quantify paperboard crease ply delamination and micro-cracking non-destructively, preventing box compression failure.
Quantifying dynamic shear planes in recycled board requires high-rate impact testing to prevent score line splitting on high-speed converting lines.
Matching dynamic Scott Bond energy above 120 J/m² prevents high-speed folder-gluer delamination and reduces net carton cost through lower line scrap.
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